SEMICONDUCTOR DEVICE INCLUDING BOTTOM SURFACE WIRING AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE
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United States of America Patent
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app pub date -
Sep 16, 2013
filing date -
Oct 30, 2009
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Abandoned
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Abstract
Disclosed herein is a semiconductor device including a semiconductor substrate, a wiring layer formed above the semiconductor substrate, a through-hole electrode extending from the bottom surface of the semiconductor substrate to the wiring layer, a bottom surface wiring provided, at the bottom surface of the semiconductor substrate such that the bottom surface wiring is connected to the through-hole electrode, and an external terminal connected to the bottom surface wiring. The bottom surface wiring has a greater film thickness than a film thickness of the through-hole electrode at least a portion of the bottom surface wiring including a connection part between the bottom surface wiring and the external terminal.
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