METHOD FOR BONDING A TANTALUM STRUCTURE TO A COBALT-ALLOY SUBSTRATE

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United States of America Patent

SERIAL NO

14079160

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Abstract

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A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.

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Patent Owner(s)

Patent OwnerAddress
ZIMMER INCWARSAW IN 46580

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Allen, Steve M Winona Lake, US 5 31
Anderson, Jeffrey P Warsaw, US 20 333
Gorhe, Devendra Warsaw, US 8 36
Hippensteel, Gregory M South Whitley, US 5 31
Peek, Lawrence F Warsaw, US 6 90

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