SENSING ARRANGEMENT, SENSOR AND APPARATUS COMPRISING SAME, AND METHOD OF MANUFACTURE THEREOF

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United States of America Patent

APP PUB NO 20140069795A1
SERIAL NO

13610097

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is concerned with a sensing arrangement. The arrangement comprises a plurality of layers laminated together. The layers include sequentially a first layer of electrode, a second layer for insulation, a third layer made principally of polydimethylsiloxane (PDMS) and a fourth layer of electrode. The third layer is provided with an array of micro-structures configured in the form of hemispheres, with convex surface of the hemispheric micro-structures oriented towards the insulation layer.

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Patent Owner(s)

Patent OwnerAddress
CITY UNIVERSITY OF HONG KONGTAT CHEE AVENUE KOWLOON HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHAN, Yan Cheong Kowloon, HK 2 7
TANG, Qing Yuan Shanghai, CN 1 0
ZHANG, Hai Zhong Beijing, CN 1 0

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