LAMINATION, CONDUCTIVE MATERIAL, AND METHOD FOR MANUFACTURING LAMINATION
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United States of America Patent
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Issued Date -
Mar 13, 2014
app pub date -
Mar 22, 2012
filing date -
Mar 23, 2011
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Abstract
A lamination includes: a substrate formed of aluminum or aluminum alloy; an intermediate layer formed of any one metal or nonmetal selected from the group consisting of silver, gold, chromium, iron, germanium, manganese, nickel, silicon, and zinc, or an alloy containing the any one metal, on a surface of the substrate; and a film layer formed by accelerating powder material of copper or copper alloy together with gas heated to a temperature lower than a melting point of the powder material and spraying and depositing a solid-phase powder material onto a surface of the intermediate layer.
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