HEAT DISSIPATION COMPOSITE AND THE USE THEREOF
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United States of America Patent
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Issued Date -
Mar 13, 2014
app pub date -
Jul 9, 2013
filing date -
Jul 9, 2012
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Abandoned
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Abstract
A multi-layer heat dissipation composite for reducing the external surface temperature of an electronic device is disclosed. The heat dissipation composite comprises a reflective component and a component with anisotropic property. The heat dissipation composite further comprises an adhesive. Some embodiments also provide methods for reducing the external surface temperature of an electronic device.
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