LAMINATED POLISHING PAD
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United States of America Patent
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Issued Date -
Mar 6, 2014
app pub date -
Apr 11, 2012
filing date -
Apr 21, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The purpose of the present invention is to provide a long-lived laminated polishing pad wherein a polishing layer is resistant to detachment from a support layer even when high temperatures are produced by long periods of polishing. This laminated polishing pad is characterized that: a polishing layer and a support layer are laminated together with an adhesive member interposed therebetween; said adhesive member is either an adhesive layer containing a polyester-based hot-melt adhesive or double-sided tape that has one of such adhesive layers on each side of a substrate; and for each 100 weight parts of a polyester-resin base polymer, said polyester-based hot-melt adhesive contains 2 to 10 weight parts of an epoxy resin that has at least two glycidyl groups per molecule.
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