Compliant micro device transfer head with integrated electrode leads
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United States of America Patent
Stats
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Jul 29, 2014
Grant Date -
Mar 6, 2014
app pub date -
Sep 6, 2012
filing date -
Sep 6, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm.
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International Classification(s)
- 2012 Application Filing Year
- H01L Class
- 20465 Applications Filed
- 18077 Patents Issued To-Date
- 88.34 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 50 Citation Count
- H01L Class
- 91.43 % this patent is cited more than
- 11 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 29, 2026 |
