SILVER ALLOY WIRE FOR BONDING APPLICATIONS

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United States of America Patent

SERIAL NO

14015119

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Abstract

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A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties:

    I. an average size of crystal grains of the core is between 0.8 μm and 3 μm,II. the amount of crystal grains having an orientation in the <001> direction in a wire cross section is in a range of 10-20%,III. the amount of crystal grains having an orientation in the <111> direction in a wire cross section is in a range of 5-15%, andIV. the total amount of crystal grains having orientations in the <001> and <111> directions in a wire cross section is in a range of 15-40%.

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Patent Owner(s)

Patent OwnerAddress
HERAEUS DEUTSCHLAND GMBH & CO KGHERAEUSSTRASSE 12 - 14 HANAU 63450

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHUNG, Eun-Kyun Nam-Ku, KR 3 13
RYU, Jae-Sung Bucheon-si, KR 2 13
TARK, Yong-Deok Namdong-gu, KR 4 19

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