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United States of America Patent
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Issued Date -
Mar 6, 2014
app pub date -
Jul 5, 2013
filing date -
Aug 31, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present disclosure provides a semiconductor device including a semiconductor element having a first surface and a second surface, which is opposite to the first surface, and a conductive via disposed on the semiconductor element. The semiconductor element includes a die; a first redistribution layer positioned on the first surface, wherein the first redistribution layer is configured to fan out the die; and a second redistribution layer positioned on the second surface of the semiconductor element. The conductive via is configured to electrically connect the first redistribution layer and the second redistribution layer, wherein the sizes of the two ends of the conductive via are different and the die can be electrically coupled to another semiconductor device through the conductive via.
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