Proximity Sensor Package and Packing Method Thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140061444A1
SERIAL NO

14018530

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A proximity sensor package and a packaging method thereof are disclosed. The proximity sensor package includes a light emitting unit and a light sensor. The light sensor has a first surface having a light sensing area. The light emitting unit is disposed on the first surface of the light sensor outside the light sensing area.

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Patent Owner(s)

Patent OwnerAddress
UPI SEMICONDUCTOR CORPORATIONTAIPEI

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Ping-Yuan Zhubei City, TW 14 29
Wang, Kun-Chang Zhubei City, TW 3 7

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