PROCESSING METHOD UTILIZING CLUSTER

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United States of America Patent

APP PUB NO 20140061031A1
SERIAL NO

13778555

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Abstract

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A processing method having excellent processing performance at a low flow rate is provided. A method for processing a surface of a sample uses reactive clusters produced by adiabatic expansion of a gas mixture ejected from a nozzle into a vacuum processing chamber. The gas mixture contains a reactive gas chlorine trifluoride, a first inert gas argon, and a second inert gas xenon. The gas mixture in an inlet of the nozzle has a pressure of 0.4 MPa (abs) or more. The reactive gas constitutes 3% by volume or more and 10% by volume or less. The first inert gas constitutes 40% by volume or more and 94% by volume or less. The second inert gas constitutes 3% by volume or more and 50% by volume or less of the gas mixture.

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Patent Owner(s)

Patent OwnerAddress
KYOTO UNIVERSITY36-1 YOSHIDA-HONMACHI SAKYO-KU KYOTO-SHI KYOTO 6068501 ?6068501
IWATANI CORPORATION6-4 HOMMACHI 3-CHOME CHUO-KU OSAKA-SHI OSAKA 5410053 ?5410053

International Classification(s)

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  • 2013 Application Filing Year
  • C23F Class
  • 303 Applications Filed
  • 260 Patents Issued To-Date
  • 85.81 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201320142015201620172018201920200255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOIKE, Kunihiko Shiga, JP 20 624
MATSUO, Jiro Kyoto, JP 30 374
SEKI, Toshio Kyoto, JP 23 288
SENOO, Takehiko Osaka, JP 11 218
YOSHINO, Yu Shiga, JP 9 308

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Patent Citation Ranking

  • 1 Citation Count
  • C23F Class
  • 11.17 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges23137211333111301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 8081 - 90100 +0102030405060708090100110120130140150

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