PROCESSING METHOD UTILIZING CLUSTER
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Mar 6, 2014
app pub date -
Feb 27, 2013
filing date -
Aug 30, 2012
priority date (Note) -
Published
status (Latency Note)
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Abstract
A processing method having excellent processing performance at a low flow rate is provided. A method for processing a surface of a sample uses reactive clusters produced by adiabatic expansion of a gas mixture ejected from a nozzle into a vacuum processing chamber. The gas mixture contains a reactive gas chlorine trifluoride, a first inert gas argon, and a second inert gas xenon. The gas mixture in an inlet of the nozzle has a pressure of 0.4 MPa (abs) or more. The reactive gas constitutes 3% by volume or more and 10% by volume or less. The first inert gas constitutes 40% by volume or more and 94% by volume or less. The second inert gas constitutes 3% by volume or more and 50% by volume or less of the gas mixture.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
JP | B2 | JP5964182 | Aug 30, 2012 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PUBLISHED GRANTED PATENT (SECOND LEVEL) | クラスタによる加工方法 | Aug 03, 2016 | |||
KR | B1 | KR102036195 | Feb 27, 2013 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PATENT SPECIFICATION | 클러스터에 의한 가공방법 | Oct 24, 2019 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KYOTO UNIVERSITY | 36-1 YOSHIDA-HONMACHI SAKYO-KU KYOTO-SHI KYOTO 6068501 ?6068501 | |
IWATANI CORPORATION | 6-4 HOMMACHI 3-CHOME CHUO-KU OSAKA-SHI OSAKA 5410053 ?5410053 |
International Classification(s)

- 2013 Application Filing Year
- C23F Class
- 303 Applications Filed
- 260 Patents Issued To-Date
- 85.81 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
KOIKE, Kunihiko | Shiga, JP | 20 | 624 |
# of filed Patents : 20 Total Citations : 624 | |||
MATSUO, Jiro | Kyoto, JP | 30 | 374 |
# of filed Patents : 30 Total Citations : 374 | |||
SEKI, Toshio | Kyoto, JP | 23 | 288 |
# of filed Patents : 23 Total Citations : 288 | |||
SENOO, Takehiko | Osaka, JP | 11 | 218 |
# of filed Patents : 11 Total Citations : 218 | |||
YOSHINO, Yu | Shiga, JP | 9 | 308 |
# of filed Patents : 9 Total Citations : 308 |
Cited Art Landscape
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Patent Citation Ranking
- 1 Citation Count
- C23F Class
- 11.17 % this patent is cited more than
- 11 Age
Forward Cite Landscape
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 6, 2025 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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