DICING BEFORE GRINDING AFTER COATING
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United States of America Patent
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Issued Date -
Feb 27, 2014
app pub date -
Oct 31, 2013
filing date -
Jul 29, 2011
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Abandoned
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Abstract
This invention is a method for singulating a semiconductor wafer into individual semiconductor dies, the top surface of the semiconductor wafer bumped with metallic pre-connections and having a coating of underfill disposed over and around the metallic pre-connection bumps. The method comprises (A) providing a semiconductor wafer having a top surface with an array of metallic pre-connection bumps and a coating of underfill disposed over and around the metallic pre-connection bumps; (B) dicing through the underfill between the metallic pre-connection bumps and into the top surface of the semiconductor wafer to the ultimate desired wafer thickness, creating dicing lines; and (C) removing wafer material from the backside of the wafer at least to the depth of the dicing lines, thus singulating the resulting dies from the wafer.
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