Halogen Free Thermoset Resin System for Low Dielectric Loss at High Frequency Applications
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United States of America Patent
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Issued Date -
Feb 27, 2014
app pub date -
May 9, 2012
filing date -
May 17, 2011
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Abstract
The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications.
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