DIE-TO-DIE ELECTRICAL ISOLATION IN A SEMICONDUCTOR PACKAGE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 27, 2014
app pub date -
Oct 18, 2013
filing date -
Jul 6, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Some of the embodiments of the present disclosure provide a semiconductor package comprising a first die; a second die; and an inductor arrangement configured to inductively couple the first die and the second die while maintaining electrical isolation between active circuit components of the first die and active circuit components of the second die. Other embodiments are also described and claimed.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully