METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
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United States of America Patent
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Feb 27, 2014
app pub date -
Aug 23, 2012
filing date -
Aug 23, 2012
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Abstract
An apparatus and method for processing wafer-shaped articles features a spin chuck that is axially displaceable between at least two exhaust levels within a surrounding collector. A gas supply system comprises ducts for supplying gas separately to a first interior region of the collector that is above the spin chuck and a second interior region that is below the spin chuck. The pressure differential within the collector above and below the spin chuck can thereby be controlled to prevent cross-contamination between collector levels.
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