FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITION
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United States of America Patent
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Issued Date -
Feb 27, 2014
app pub date -
Jul 11, 2011
filing date -
Mar 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is a flux for soldering, containing a base resin and an activating agent, in which the base resin contains a thermoplastic acrylic resin obtained by polymerizing a monomer component containing a long chain alkyl(meth)acrylate, the long chain alkyl moiety of the long chain alkyl(meth)acrylate has a branched structure having 12 to 23 carbon atoms, and the acrylic resin has a weight average molecular weight of 30000 or less. A solder paste composition of the present invention improves wettability, storage stability and crack resistance in residue portions, and printability for fine portions without adhering to a squeegee when printed.
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