TECHNIQUE FOR MONITORING STRUCTURAL HEALTH OF A SOLDER JOINT IN NO-LEADS PACKAGES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 20, 2014
app pub date -
Aug 13, 2013
filing date -
Aug 14, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A printed circuit board (PCB) and a system utilizing the same is presented for use in monitoring a solder joint between the PCB and a package. The PCB comprises at least one slotted pad and at least one health monitoring circuit (HMC). The slotted pad comprises a first pad connected to a ground of the PCB, and a separate second pad, both pads of the slotted pad being configured for being joined via a single solder joint to a single pad of the package. The first and second pads are connected to the HMC, the HMC comprising: a test oscillator configured for generating a known current flowing via the second pad, the solder joint, and the first pad; and a measuring unit for measuring a voltage between the first and second pads of the PCB, thereby enabling calculation of the solder joint's resistance.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully