BONDING OF THIN LAMINA
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United States of America Patent
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Issued Date -
Feb 20, 2014
app pub date -
Aug 10, 2013
filing date -
Aug 15, 2012
priority date (Note) -
Abandoned
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Abstract
Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina is fixed to the first carrier, where the fixing includes a first application of heat and pressure to a portion of the lamina and the first carrier. The support plate is removed, and a second application of heat and pressure are applied to the lamina and the first carrier. The second application of heat and pressure promotes an adhesive bond between the lamina and the first carrier. The second application of pressure comprises moving the lamina, the first carrier and a cover sheet between a pair of rollers.
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