IN-LINE DEPOSITION CHAMBER DESIGN FOR MULTI-STAGE PHYSICAL VAPOR DEPOSITION
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United States of America Patent
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Issued Date -
Feb 13, 2014
app pub date -
Aug 9, 2012
filing date -
Aug 9, 2012
priority date (Note) -
Abandoned
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Abstract
An in-line multi-stage physical vapor deposition chamber is disclosed. The deposition chamber includes a cylindrical shaped main body, multiple dividers disposed within the main body and extending in radial directions to divide the interior space of the main body into multiple fan shaped zones, and a cylindrical shaped substrate holder disposed coaxially with the main body. The substrate holder is rotatable around a central axis, and individual substrates or a continuous flexible substrate is mounted on the substrate holder parallel to the central axis. Multiple metal source holders are disposed on the cylindrical sidewall of the main body in at least some of zones for mounting metal sources. Some zones are provided with heating mechanisms for heating the substrate. A load-lock chamber is connected to the main body for loading and unloading substrates into and from a first zone.
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