Device module and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9872409
SERIAL NO

13958926

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Importance

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Abstract

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The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HOSIDEN CORPORATION4-33 KITAKYUHOJI 1-CHOME OSAKA YAO-SHI 5810071

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Isoda, Takeshi Yao, JP 87 885
Shinoda, Koji Yao, JP 39 123

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