HOT MELT ADHESIVES FOR MULTILAYER STRUCTURE ENCLOSURES

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United States of America Patent

APP PUB NO 20140037876A1
SERIAL NO

14048304

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Abstract

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The invention provides enclosure adhesives, methods of using the adhesives to bond for enclosing a multilayer structure and to articles of manufacture comprising the adhesives. The multilayer structure is a laminant of at least one composite film and at least one Kraft paper substrates. It has been discovered that an adhesive that comprises (a) a mixture of 1:1 to 5:2 of a metallocene catalyzed polyolefin copolymer with a density greater than or equal to 0.880 g/cm3 to a metallocene catalyzed polyolefin copolymer with a density less than 0.880 g/cm3; (b) a compatible tackifier; and (c) a compatible wax, has high adhesion to both Kraft and composite film with low blocking properties.

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Patent Owner(s)

Patent OwnerAddress
HENKEL CORPORATION1001 TROUT BROOK CROSSING ROCKY HILL CT 06067

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Esangbedo, Christine Springfield, US 1 2
Hayes, Patrick Ringoes, US 38 516

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