DEPOSITING THIN LAYER OF MATERIAL ON PERMEABLE SUBSTRATE
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United States of America Patent
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Issued Date -
Feb 6, 2014
app pub date -
Oct 15, 2013
filing date -
Feb 18, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments relate to depositing a layer of material on a permeable substrate by passing the permeable substrate between a set of reactors. The reactors may inject source precursor, reactant precursor, purge gas or a combination thereof onto the permeable substrate as the permeable substrate passes between the reactors. Part of the gas injected by a reactor penetrates the permeable substrate and is discharged by the other reactor. The remaining gas injected by the reactor moves in parallel to the surface of the permeable substrate and is discharged via an exhaust portion formed on the same reactor.
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