SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PACKAGE STRUCTURE THEREOF
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United States of America Patent
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Issued Date -
Feb 6, 2014
app pub date -
Jul 31, 2012
filing date -
Jul 31, 2012
priority date (Note) -
Abandoned
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Abstract
A semiconductor manufacturing method includes providing a carrier having a metallic layer, wherein the metallic layer comprises a plurality of base areas and a plurality of outer lateral areas; forming a first photoresist layer; forming a plurality of bearing portions; removing the first photoresist layer to reveal the bearing portions, each bearing portion comprises a bearing surface having a first area and a second area; forming a second photoresist layer for revealing the first areas of the bearing surfaces; forming a plurality of connection portions, wherein the first areas of the bearing surfaces are covered by the connection portions to make each connection portion connect with each bearing portion to form a snap bump; removing the outer lateral areas of the metallic layer to make the base areas form a plurality of under bump metallurgy layers.
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