Method for Adhering Materials Together
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United States of America Patent
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app pub date -
Oct 8, 2013
filing date -
Jul 22, 2005
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Abandoned
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Abstract
The present invention provides a method for adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.
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