SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURING METHOD THEREOF

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United States of America Patent

APP PUB NO 20140034138A1
SERIAL NO

14111865

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Abstract

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The present invention relates to a semiconductor manufacturing device, which can be applied in a semiconductor metal interconnection process, and a manufacturing method thereof. The semiconductor manufacturing device includes a loadlock chamber, at least one process chamber, a transfer chamber, and an oxidation preventing gas supply unit. The process chamber processes an annealing process by receiving a substrate. The transfer chamber transfers the substrate between the loadlock chamber and the process chamber. The oxidation preventing gas supply unit supplies oxidation preventing gas into either the transfer chamber or the loadlock chamber.

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Patent Owner(s)

Patent OwnerAddress
WONIK IPS CO LTDSOUTH KOREA GYEONGGI DO PING ZE ZHENWEI ZHENWEI GROUP PRODUCED 75 ROAD SURFACE PYEONGTAEK GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Ki-Hoon Yongin-si, KR 15 419
Ryu, Dong-Ho Hwaseong-si, KR 2 103

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