HIGH PRESSURE, HIGH POWER PLASMA ACTIVATED CONFORMAL FILM DEPOSITION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 30, 2014
app pub date -
Jul 29, 2013
filing date -
Jul 30, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Methods and apparatus for depositing a film on a substrate surface including plasma assisted surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption and reaction are provided. The embodiments disclosed herein relate to methods and apparatus for performing conformal film deposition and atomic layer deposition reactions that result in highly uniform films with low particle contamination. According to various embodiments, the methods and apparatus involve high deposition chamber pressures and plasma generation using high radio frequency powers.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully