STACK PACKAGES USING RECONSTITUTED WAFERS
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United States of America Patent
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Issued Date -
Jan 30, 2014
app pub date -
Sep 25, 2013
filing date -
Aug 3, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.
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