SEMICONDUCTOR LAMINATE AND PROCESS FOR PRODUCTION THEREOF, AND SEMICONDUCTOR ELEMENT

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United States of America Patent

APP PUB NO 20140027770A1
SERIAL NO

14110420

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Abstract

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A semiconductor laminate having small electric resistivity in the thickness direction; a process for producing the semiconductor laminate; and a semiconductor element equipped with the semiconductor laminate. include a semiconductor laminate including a Ga203 substrate; an AlGalnN buffer layer which is formed on the Ga203 substrate; a nitride semiconductor layer which is formed on the AlGalnN buffer layer and contains Si; and an Si-rich region which is formed in an area located on the AlGalnN buffer layer side in the nitride semiconductor layer and has an Si concentration of 5×1018/cm3 or more.

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Patent Owner(s)

Patent OwnerAddress
TAMURA CORPORATION1-19-43 HIGASHI-OIZUMI NERIMA-KU TOKYO 1788511
KOHA CO LTD6-8 KOUYAMA 2-CHOME NERIMA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iizuka, Kazuyuki Tokyo, JP 33 311
Morishima, Yoshikatsu Tokyo, JP 11 147
Sato, Shinkuro Tokyo, JP 7 8

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