METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES
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United States of America Patent
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Issued Date -
Jan 30, 2014
app pub date -
Jul 30, 2012
filing date -
Jul 30, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus and method for treating a wafer-shaped article utilizes a gas supply hood that can be positioned in a working position above a holder so as to cover all or substantially all of a wafer shaped article when positioned on the holder. The gas supply hood accommodates a fluid dispenser for dispensing at least one fluid onto an upper surface of the wafer shaped article positioned on the holder. The gas supply hood permits the fluid dispenser to be moved laterally of the holder and the gas supply hood while the gas supply hood is in the working position and without moving the gas supply hood.
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