MOISTURE-CURABLE HOT MELT ADHESIVE

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United States of America Patent

SERIAL NO

13770277

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Abstract

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Disclosed is a moisture-curable hot melt adhesive which has a high initial adhesive strength and is also excellent in adhesion to a slightly adhesive material. This adhesive comprises an urethane prepolymer having an isocyanate group at its end, and (A) an acrylic polymer, wherein the acrylic polymer has a polymer (A1) containing a moiety derived from a (meth)acrylic acid derivative (a1) having an alkyl group with 6 or more carbon atoms. In some embodiments the acrylic polymer (A) has an alicyclic structure.

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Patent Owner(s)

Patent OwnerAddress
HENKEL CORPORATIONROCKY HILL CT

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tamogami, Tsuyoshi Osaka, JP 10 19
Yoshida, Yoshio Kyoto City, JP 100 1092

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