METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUGH HOLE
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United States of America Patent
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app pub date -
Sep 24, 2013
filing date -
Oct 16, 2006
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Abandoned
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Abstract
There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and the metal wiring includes a polycrystalline region of the solder alloy. The metal wiring of the present invention is superior in conductivity.
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