SUBSTRATE PROCESSING APPARATUS

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United States of America Patent

SERIAL NO

14034636

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Abstract

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A substrate processing apparatus for processing a substrate with plasma including: a container including a first container member that forms a processing space in which the substrate is processed, and a second container member that forms a plasma generation space in which plasma is generated a gas introduction unit for introducing gas into the container; a plasma generation unit including an antenna that is provided in an external space of the container and configured to excite the gas in the plasma generation space with an electric field that is generated by a high-frequency voltage fed from a power supply; and a substrate holding unit that is capable of holding the substrate. A coating film that contains a semiconductor material is formed on a surface of the second container member that is arranged close to the antenna.

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Patent Owner(s)

Patent OwnerAddress
CANON ANELVA CORPORATION2-5-1 KURIGI ASAO-KU KAWASAKI-SHI KANAGAWA-KEN 2158550

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Masami Kunitachi-shi, JP 36 398
Osada, Tomoaki Fuchu-shi, JP 34 538
Yoshida, Tatsuhiko Inagi-shi, JP 2 42

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