ELECTRONIC COMPONENT WITH HEAT-DISSIPATING PLATE AND BOARD EMPLOYING SAID COMPONENT
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United States of America Patent
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Issued Date -
Jan 16, 2014
app pub date -
Mar 30, 2012
filing date -
Apr 8, 2011
priority date (Note) -
Abandoned
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Abstract
Electronic component includes a plurality of pins (10) to be soldered onto a printed circuit (2), the component furthermore including a heat-dissipating plate (11) for dissipating heat originating from the component (1), the heat-dissipating plate (11) being intended to be soldered onto a conducting region (211) on the surface of the printed circuit (2), the component further including testing elements (110, 10a) in the form of a pin (10a) directly electrically connected to the heat-dissipating plate (11) for monitoring electrical characteristics of the connection established between the heat-dissipating plate (11) and the conducting region (211), such as the continuity or the impedance. An electronic board incorporating the component is also described.
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