CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
Jan 16, 2014
app pub date -
Jul 12, 2012
filing date -
Jul 12, 2012
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Abandoned
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Abstract
A circuit device includes: a substrate having an insulative upper surface; a hydrophobic anti-plating layer of a hydrophobic material formed on the upper surface of the substrate and having at least one patterned through-hole for exposing a plating portion of the upper surface of the substrate; an active metal layer formed on the plating portion of the upper surface of the substrate and disposed in the patterned through-hole in the hydrophobic anti-plating layer; and an electroless deposited metal layer electroless deposited on the active metal layer.
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