COPPER ALLOY CONTAINING COBALT, NICKEL AND SILICON
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United States of America Patent
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Issued Date -
Jan 16, 2014
app pub date -
Apr 17, 2013
filing date -
Jul 5, 2002
priority date (Note) -
Abandoned
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Abstract
A process for manufacturing copper-nickel-silicon alloys includes the sequential steps of casting the copper alloy; hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; solutionizing the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; first age annealing the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; cold working the multi-phase alloy to effect a second reduction in cross-sectional area; and second age annealing the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.
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