INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Sep 11, 2013
filing date -
Sep 21, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A solid semiconductor sealing composition that includes (A) an epoxy resin, and (B) a clathrate complex. The clathrate complex contains (b1) at least one of 5-hydroxyisophthalic acid and 5-nitroisophthalic acid; and (b2) at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole. A method of sealing a solid semiconductor using the sealing composition.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully