Mesh electrode adhesion structure, electron emission device and electronic apparatus including the electron emission device

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United States of America Patent

PATENT NO 8938049
SERIAL NO

13893519

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Abstract

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A mesh electrode adhesion structure includes: a substrate, and an opening defined in the substrate; a mesh electrode on the substrate, and a first combination groove defined in the mesh electrode; and an adhesion layer between the substrate and the mesh electrode. The mesh electrode includes: a mesh region corresponding to the opening defined in the substrate, and an adhesion region in which the first combination groove exposes the adhesion layer.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU GYEONGGI-DO SUWON-SI 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Tae-won Yongin-si, KR 49 157
Kim, Do-yoon Hwaseong-si, KR 23 148
Kim, Il-hwan Seoul, KR 41 277
Kim, Yong-chul Seoul, KR 67 500
Park, Shang-hyeun Yongin-si, KR 66 242

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