TEMPERATURE TUNED FAILURE DETECTION DEVICE
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United States of America Patent
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Issued Date -
Jan 9, 2014
app pub date -
Jul 4, 2012
filing date -
Jul 4, 2012
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Abstract
The embodiments described herein relate to BMG parts and related failure detection devices. The BMG parts can be formed of a material including at least one or more amorphous alloys having binary physical properties in response to a temperature. The BMG parts can be configured in failure detection devices, which can be used for controlling and detecting failures, determining mechanical and temperature parameters, and/or providing protection and switching functions to an electronic system that contains the BMG parts and/or the failure detection devices.
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