CABINET FOR ELECTRONIC APPARATUS AND AN ELECTRONIC APPARATUS
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United States of America Patent
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Issued Date -
Jan 9, 2014
app pub date -
Jun 27, 2013
filing date -
Jul 4, 2012
priority date (Note) -
Abandoned
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Abstract
In a cabinet for electronic apparatus, when Mg—Li alloy is employed to reduce weight of the cabinet and depressions are molded on a surface of the cabinet through presswork by using the Mg—Li alloy, neither a rough surface nor a crack appears in any bent portion forming the depressions of the cabinet. In a cabinet for electronic apparatus including a bump shape including at least one surface formed by conducting presswork for magnesium-lithium alloy, the bump shape is a shape in which a new surface formed when a reference surface before the presswork of the magnesium-lithium alloy is pushed toward the inside of the cabinet by the presswork and is placed apart from the reference surface is surrounded by the reference surface, the surface has a plate thickness t (mm) in a range of 0.4≦t≦2.0, and at least one bent portion constituting the bump shape has a radius of curvature R (mm) in a range of t≦R.
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