SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

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United States of America Patent

APP PUB NO 20140008420A1
SERIAL NO

13544254

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Abstract

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A substrate treating method including: a coating step in which a coating film of a liquid material comprising a metal and a solvent is formed on a first substrate and a second substrate; and a heating step in which the coating film is heated in a state where the first substrate and the second substrate are held in a manner such that the coating film formed on the first substrate faces the coating film formed on the second substrate.

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Patent Owner(s)

Patent OwnerAddress
TOKYO OHKA KOGYO CO LTD150 NAKAMARUKO NAKAHARA-KU KANAGAWA KAWASAKI-SHI 211-0012

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyamoto, Hidenori Kawasaki-shi, JP 194 2107

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