Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings
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United States of America Patent
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Issued Date -
Jan 9, 2014
app pub date -
Oct 22, 2012
filing date -
Feb 4, 2003
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Abandoned
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Abstract
Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.
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