CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

14021053

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit board is formed such that a printed circuit board is connected to an injection molded circuit board. An internal circuit conductor is exposed at conductor part at a printed circuit board mounting part. Through holes are provided in the printed circuit board. The conductor part is formed substantially perpendicular to the circuit board mounting part, and is inserted into a through hole. A female screw part is formed in the vicinity of the conductor part in the printed circuit board mounting part. The female screw part can be screwed together with a bolt, which is a securing member. The printed circuit board is connected to the conductor part by solder. A hole is formed in advance in the vicinity of the solder on the printed circuit board. The bolt passes through the hole and is secured to the female screw part.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTDJAPAN TOKYO CHIYODA TOKYO TOKYO METROPOLIS
FURUKAWA AUTOMOTIVE SYSTEMS INC1000 AMAGO KOURA-CHO INUKAMI-GUN SHIGA 5220242

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ABE, Kyutaro Tokyo, JP 10 26
FUKAI, Hiroyuki Tokyo, JP 11 69
KIHARA, Yasushi Tokyo, JP 19 123
TAKAHASHI, Naomi Tokyo, JP 15 41
UTSUMI, Juro Tokyo, JP 1 1

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