LIQUID-COOLING HEAT DISSIPATION APPARATUS FOR ELECTRONIC ELEMENTS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 9, 2014
app pub date -
Jul 3, 2012
filing date -
Jul 3, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A liquid-cooling heat dissipation apparatus for electronic elements comprises an air fan and a liquid-cooling heat dissipation module. The air fan includes a frame and a vane installed on the frame to provide cooling airflow. The liquid-cooling heat dissipation module includes a liquid delivery duct, a liquid return duct, a heat collection element connected to the liquid delivery duct and liquid return duct and coupled with an electronic element to absorb heat, a heat dissipation element to receive the heat from the heat collection element through the liquid return duct and receive the cooling airflow to lower the heat, and a liquid delivery element to provide kinetic energy to drive circulation of the heat from the liquid delivery duct to the liquid return duct. The heat dissipation element and liquid delivery element form a housing space to hold the vane of the air fan.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully