MANUFACTURING METHOD OF ELECTRONIC PACKAGING
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United States of America Patent
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Issued Date -
Jan 9, 2014
app pub date -
Jul 5, 2012
filing date -
Jul 5, 2012
priority date (Note) -
Abandoned
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Abstract
A manufacturing method of electronic packaging includes the steps of preparing a metallic plate having an array of cover portions, soldering the metallic plate to a circuit board having encapsulated areas corresponding to the cover portions and employing a cutting process to obtain multiple electronic packages. Thus, the invention has the advantages of low cost and high efficiency
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