HARDENER FOR EPOXY RESIN SYSTEMS AND USE THEREOF
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United States of America Patent
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Issued Date -
Jan 2, 2014
app pub date -
Jun 25, 2013
filing date -
Jun 29, 2012
priority date (Note) -
Abandoned
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Abstract
A hardener system for epoxy resins comprising i) at least one aromatic dianhydride compound A having a melting point of at least 35° C., ii) at least one monoanhydride compound B having a melting point of not more than 30° C. and iii) at least one catalyst C, is provided. The aromatic dianhydride compound A is dispersed in the hardener system. The present invention further provides for the use of said hardener systems and to processes for hardening epoxy resin systems.
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