MICROPHONE ARRANGEMENT
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United States of America Patent
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N/A
Issued Date -
Jan 2, 2014
app pub date -
Jun 28, 2012
filing date -
Jun 28, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A microphone arrangement including a stack, the stack further including a MEMS microphone and a MEMS interface. The MEMS microphone includes a semiconductor body having a movable member on a first main surface, and the MEMS interface includes another semiconductor body having contact pads on a second main surface. The MEMS microphone and the MEMS interface are electrically connected via the contact pads with the first main surface facing the second main surface.
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