Method Of Manufacturing Gallium Nitride Substrate And Gallium Nitride Substrate Manufactured By The Same

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United States of America Patent

APP PUB NO 20140001484A1
SERIAL NO

13927334

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Abstract

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A method of manufacturing a gallium nitride (GaN) substrate and a GaN substrate manufactured by the same. The method includes the steps of growing a GaN film on a base substrate and separating the base substrate from the GaN film. The step of growing the GaN film includes forming pits in the GaN film, the pits inducing an inversion domain boundary to be formed inside the GaN film. The GaN substrate can have a predetermined thickness with which it can be handled during layer transfer (LT) processing, and the warping of the GaN substrate can be minimized, thereby preventing cracks due to warping.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG CORNING PRECISION MATERIALS CO LTD644-1 JINPYEONG-DONG GUMI-SI GYEONGSANGBUK-DO 730-735

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Junyoung ChungCheongNam-Do, KR 6 9
Choi, JunSung ChungCheongNam-Do, KR 20 15
Kim, Joon Hoi ChungCheongNam-Do, KR 10 5
Kim, Woorihan ChungCheongNam-Do, KR 2 3
Lee, DongYong ChungCheongNam-Do, KR 6 14
Lee, Wonjo ChungCheongNam-Do, KR 13 122
Lim, Sungkeun ChungCheongNam-Do, KR 46 104
Park, Boik ChungCheongNam-Do, KR 16 170
Park, Cheolmin ChungCheongNam-Do, KR 46 128
Woo, KwangJe ChungCheongNam-Do, KR 7 3

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