POLISHING SLURRY AND POLISHING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jan 2, 2014
app pub date -
Nov 24, 2011
filing date -
Mar 29, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention provides a polishing technique capable of polishing, at a high speed, a substrate containing Al and having high hardness, such as single-crystal sapphire substrate, and capable of providing a polished surface of high accuracy. The present invention relates to a polishing slurry for polishing a substrate containing aluminum, comprising abrasive grains, an inorganic boron compound having a solubility in water at 20° C. of 0.1 g/100 g—H2O or more, and water. In the present invention, it is preferable that the content of the inorganic boron compound is 0.1% by mass to 20% by mass in terms of boron atoms based on the polishing slurry.
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