FIXING TECHNOLOGY FOR COMPONENT ATTACH

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140000804A1
SERIAL NO

13539994

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Abstract

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A pick and place system with an integrated light source to partially cure a light-curable adhesives onto which components have been placed. After a light-curable adhesive in liquid or low viscosity form is applied to a location on a substrate, a pick-and-place head uses a vacuum introduced to its nozzle-like opening to pick a component and place it on to the light-curable adhesive. The pick-and-place head then transmit an appropriate light through the same nozzle-like opening to at least partially cure the adhesive. The component becomes, therefore, at least partially fixed to the substrate and will not shift as the substrate is moved.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS PTE LTD28 ANG MO KIO INDUSTRIAL PARK 2 SINGAPORE 569508

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheh, Cheng-hai Singapore, SG 6 60
Looi, Han Kong Singapore, SG 1 45

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