THERMOPLASTIC MOLDING COMPOUNDS ON THE BASIS OF STYRENE COPOLYMERS AND POLYAMIDES HAVING IMPROVED LOW-TEMPERATURE TOUGHNESS
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United States of America Patent
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Issued Date -
Dec 26, 2013
app pub date -
Dec 19, 2011
filing date -
Dec 20, 2010
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Abandoned
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Abstract
The invention relates to thermoplastic molding compounds, containing a) 3 to 91.9 wt % of one or more styrene copolymers as component A, b) 3 to 91 wt % of one or more polyamides as component B, c) 3 to 50 wt % of one or more graft natural rubbers as component C, d) 0.1 to 25 wt % of one or more compatibilizers as component D, and e) 2 to 30 wt % of ethylene-1-octene copolymer having functional groups as component E, said thermoplastic molding compounds having improved low-temperature toughness.
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